The Leading PEEK Parts Manufacturer to Set Industry Standards

i550G (unfilled PEEK or natural PEEK)

i550G is one of unfilled or natural PEEK.Outstanding chemical resistance and a high operating temperature (up to 250℃/480F) round out PEEK profile.i550G has excellent dimensional stability combined with high creep stability, ensuring the suitability of PEEK for the most sophisticated machined parts.

i550GL30 ( 30% glass fiber filled PEEK)

Compared with unfilled PEEK(i550G),this 30% glass fiber reinforced PEEK material(i550GL30) exhibits increased mechanical strength and high rigidity.Plus, improved creep strength and dimensional stability are delivered by the 30% glass fiber filled PEEK.

i550CA30 (30% carbon fiber filled PEEK)

i550CA30 is a 30% carbon filled PEEK material that is manufactured by iPEEK® PEEK. Its carbon fiber reinforcement supports the material a high level of rigidity. Carbon fiber reinforced PEEK demonstrates very high mechanical strength values.

i550FC30( FC wear-resistant series)

i550FC30 black is developed especially for bearing and sliding applications. HPV PEEK is based on a PEEK polymer that has been modified with 10% each of PTFE, graphite and carbon fibres. It combines the properties of a high-grade matrix material with special, wear-improving additives.

i770CM10(Ceramic PEEK)

Excellent dimensional stability

Nano ceramic filling, excellent dimensional stability, can be used for semiconductor chip test boxes, processing micropores without burrs and deformation.

iPEEK® ceramic PEEK retains the original toughness and strength of PEEK.

Commonly used brand: i770CM10 White,i770CM Tooth,i770CM Gingiva

ESD i770G(Anti Static PEEK)

The surface resistivity is uniform and controllable, which can meet the conventional demand of 10 5-8 ohms/square meter.

Different formula schemes can be provided according to different application requirements. Commonly used brand: ESD i770G ,ESD i550G,ESD i330G

i770G LR (Low thermal conductivity)

The thermal conductivity is as low as Wm-1K-1, which can be used in applications that require thermal insulation.

Commonly used brand: i770G LR ,i550G LR ,i330G LR

i770PF(PEEK Powder)

Coarse powder (particle size: 500μm-800 μm) Suitable for composite modification with MI=10~80 g/10min-1

Fine powder (particle size: 70μM-100μm) Suitable for composite modification, molded with MI=20-40 g/10min-1

Micro powder (particle size: 15μM-25μm) Suitable for composite modification, pre impregnation, spray coating with MI=70-80 g/10min-1