DONGGUAN REDSPOT TECHNOLOGY CO.,LTD.

PEEK Solutions across Electronic Industry

聚醚醚酮广泛应用于消费电子、家用电器和电子行业的半导体产品。PEEK聚合物可以承受连续使用的高温和苛刻的化学物质，改性PEEK提供了一系列导电、防静电或静电耗散特性，这些特性对于真空无痕吸盘等半导体应用非常重要。

iPEEK®聚醚醚酮解决方案适用于各种环境并满足最严格的要求，与传统材料相比，基于聚醚醚醚酮的组件成本更低，例如用集成聚醚酮组件取代金属可以通过重量减轻将电器的能效提高2%，有助于将晶圆厂生产率提高3%，使用寿命比PPS更长。

与iPEEK®携手应对您在不断变化的电子行业中面临的挑战。

Explore our PEEK-type Solutions

PEEK在电子半导体领域具有许多优势：

● 耐高温（最高260°C连续工作温度）

● 优异的耐化学性

● 良好的尺寸耐受性（低热膨胀）

● 刚度、坚固性、韧性和最小蠕变倾向的最佳比例

● 非常好的摩擦学性能

● 良好的抗辐射性

● 优异的抗水解性

● 防火性能：阻燃、低烟密度、无有毒气体

● 良好的机械加工性

● 良好的粘合性和焊接性

典型产品：PEEK贴片夹、PEEK真空吸盘、CMP环、PEEK吸尘器、PEEK螺丝

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CASE STUDY - CMP Ring

A very important step in silicon wafer production is the Chemical Mechanical Planarization (CMP) process. The trend is towards larger wafer sizes, smaller chips with narrower line widths and feature sizes. The challenge is to find a material with the desired characteristics, as the CMP process requires components made of highly qualified materials. In close cooperation with customers, we have specialised in developing materials that meet these requirements.

Product Processing and Quality Control Capability

Cool Jet dry ice deburring equipment lmprove the quality of machined parts

● Non-dastuntive cleanina;

● Improve product quality and reduce-scrap rate;

● No manual removal of burrs and Haps;

● No secondary waste;

● Faster and more uniform removal of bums and flaps.